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Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.65mm ; Surface Finished : Immersion Tin ; Unit Size(mm) : 61.2*97.4 ; Min W/S(mil) : 254.4*208.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 5.9/8 ; Peelable Mask+High Temperature Adhesive ;
https://www.hoyogo.com/Products/HYG088R04017A.htmlLayer : 2L ; Base Material : FR4 TUC TU768 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : Immersion Tin ; Unit Size(mm) : 98.5*118.5 ; Panel Size(mm) : 243.0*301.5 ; Min W/S(mil) : 7.87 ; Min Hole Size : 0.3mm ; Solder Mask : Dark Green ; Peelable Mask+High Temperature...
https://www.hoyogo.com/Products/HYG088R02021F.htmlLayer : 2L ; Base Material : FR4 TG130 ; Board Thickness : 2.4mm ; Final Copper Thickness : 35um ; Surface Finished: HASL Lead Free ; Unit Size(mm) : 200.4*222.02 ; Panel Size(mm) : 200.4*222.02 ; Min W/S(mil) : 10/6.2 ; Peelable mask+high temperature adhesive ;
https://www.hoyogo.com/Products/products-26652054471.html
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