Layer : 2L
Base Material : FR4 TUC TU768
Board Thickness : 1.6mm
Final Copper Thickness : 1OZ
Surface Finished : Immersion Tin
Unit Size(mm) : 98.5*118.5
Panel Size(mm) : 243.0*301.5
Min W/S(mil) : 7.87
Min Hole Size : 0.3mm
Solder Mask : Dark Green
Peelable Mask+High Temperature Adhesive
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.