Immersion Tin

HYG088R04017A

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.65mm ; Surface Finished : Immersion Tin ; Unit Size(mm) : 61.2*97.4 ; Min W/S(mil) : 254.4*208.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 5.9/8 ; Peelable Mask+High Temperature Adhesive ;

HYG088R04039B

Layer: 4L ; Base Material: FR4 TUC TU768 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: Immersion Tin ; Unit Size(mm): 30.0*24.0 ; Panel Size(mm): 158.0*118.0 ; Min Hole Size: 0.3mm ; Solder Mask: PSR-4000 SN10 ; Solder Mask Thickness: 10-30um ;

0.4mm FR4 Immersion Tin

HYG088R02021F|High Temperature Adhesive

Layer : 2L ; Base Material : FR4 TUC TU768 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : Immersion Tin ; Unit Size(mm) : 98.5*118.5 ; Panel Size(mm) : 243.0*301.5 ; Min W/S(mil) : 7.87 ; Min Hole Size : 0.3mm ; Solder Mask : Dark Green ; Peelable Mask+High Temperature...

HYG528R02383A | Rigid flex pcb

Layer : 2L ; Base Material : 50UM PI+Stiffener ; Board Thickness : 0.325mm ; Final Copper Thickness : 1.5OZ ; Surface Finished : Immersion Tin ; Min W/S(mil) : 7.9/8.32 ; Unit Size(mm) : 27.00*107.35 ; Panel Size(mm) : 131.35*142.15 ;

Immersion Tin PCB

Layer: 2L  Base Material: FR4 TUC TU768  Board Thickness: 1.0mm  Final Copper Thickness: 1OZ  Surface Finished: Immersion Tin+Edge Plating  Unit Size(mm): 30.5*15.0  Panel Size(mm): 183.0*158.5  Solder Mask: Dark Green  Solder Mask Thickness: min 10um 

Immersion Tin PCB

Layer: 6L Base Material: FR4 TG150 Board Thickness: 1.0mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Immersion Tin Unit Size(mm): 30.0*50.95 Panel Size(mm): 231.5*182.5 Min W/S(mil): 5.9/5.9 Min Hole Size: 0.2mm Solder Mask: Green Matt

HYG528R01015A

Layer : 1L ; Base Material : FR4 ; Board Thickness : 0.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : Immersion Tin ; Unit Size(mm) : 495.0*120.0 ; Solder Mask : White ;