Layer : 2L
Base Material : 50UM PI+Stiffener
Board Thickness : 0.325mm
Final Copper Thickness : 1.5OZ
Surface Finished : Immersion Tin
Min W/S(mil) : 7.9/8.32
Unit Size(mm) : 27.00*107.35
Panel Size(mm) : 131.35*142.15
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.