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Layer : 2L ; Base Material : 50UM PI+Stiffener ; Board Thickness : 0.325mm ; Final Copper Thickness : 1.5OZ ; Surface Finished : Immersion Tin ; Min W/S(mil) : 7.9/8.32 ; Unit Size(mm) : 27.00*107.35 ; Panel Size(mm) : 131.35*142.15 ;
https://www.hoyogo.com/Products/HYG528R02383A.htmlLayer: 6L ; Base Material: FR4(TG170)+PI ; Board Thickness: 1.08mm ; Final Copper Thickness: 1oz ; Surface Finished: ENIG ; Unit Size（mm）：140.0*50.0 ; Panel Size（mm）：140.0*200.0 ; Min Hole Size : 0.12mm ; Min Hole Copper Thickness : 20um ; Min W/S(mil): 3.94/3.94 ; Solder Mask: green ; Coverlay: ye...
https://www.hoyogo.com/Products/rigid-flexPCBHYG306R.html
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