High density PCB

High density PCB

HYG882R06016A

High density PCB ; Layer: 6L ; Base Material: FR4 ; Board Thickness: 1.575mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 135.89*33.15 ; Panel Size(mm): 152.40*193.04 ; Min W/S(mil): 8/10 ; Min Hole Size: 0.25mm ;

1L-FR4 PI-High density pcb

3L-high density pcb

Intelligent Mobile Phone Application PCB

Layer : 4L ; Base Material : FR4 TG150 ; Stack-Up : 1 Step(1+2+1) ; Board Thickness : 0.8mm ; Surface Finished : ENIG+OSP ; Min Hole Size : 0.1mm ; Application : Intelligent Mobile Phone ;

HYG812A01018A