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Layer: 14L ; Base Material: FR4 ; Board Thickness: 2.13mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Impedance control ; Unit Size(mm): 140.0*127.0 ; Panel Size(mm): 165.4*152.4 ; Min W/S(mil): 3.8/4.0 ; Min Hole Size: 0.2mm ; Solder Mask Thickness: 10-50um ;
https://www.hoyogo.com/Products/HYG882R14020A.htmlLayer: 4L ; Base Material: FR4 TG170 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 156.6*224.0 ; Panel Size(mm): 180.6*234.0 ; Min W/S(mil): 5.2/6.3 ; Min Hole Size: 0.35mm ; Special Request: Impedance Control ;
https://www.hoyogo.com/Products/HYG026R04033A.htmlSpecial Request: Impedance Control Layer: 4L Base Material: FR4 S1000-2 TG170 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 156.6*224.0 Panel Size(mm): 180.0*234.0 Min W/S(mil): 5.2/6.3
https://www.hoyogo.com/Impedance-Control-PCB.htmlImpedance Control PCB Layer: 6L Base Material: FR4 TG150 Board Thickness: 0.8mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 75.0*75.0 Panel Size(mm): 176.0*245.0 Min W/S(mil): 4/4 Min Hole Size: 0.2mm Special Request: BGA
https://www.hoyogo.com/6-Layer-Impedance-Control-PCB.htmlLayer: 14L Base Material: FR4 Isola FR408-HR Board Thickness: 2.13mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 140.0*127.0 Panel Size(mm): 165.4*152.4 Min W/S(mil): 3.8/4.0 Min Hole Size: 0.2mm Solder Mask: PSR-4000 Solder Mask Thickness: 10-50um Special Req...
https://www.hoyogo.com/14L-Impedance-Control-PCB.html
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