Layer : 2L with NPTH
Base Material : CEM3(R-1787) CTI≥600
Board Thickness : 1mm
Final Copper Thickness : 1OZ
Surface Finished : OSP
Unit Size(mm) : 157.99*157.99
Panel Size(mm) : 170.43*508.0
Min W/S(mil) : 16/10
Solder Mask : White
Special Process : Plate Bending&Twist 0.7%
Solder Mask Thickness : Line Angle 8um(min)
V-Cut Remaining Thickness : 0.5mm+0.2/-0mm
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.