Layer : 12L
Base Material : FR4
Board Thickness : 1.8mm
Final Copper Thickness : 1OZ
Surface Finished : ENIG
Unit Size(mm) : 50.8*50.8
Panel Size(mm) : 114.3*167.64
Min W/S(mil) : 5/5
Min Hole Size : 0.2mm
Solder Mask : Blue
Special Request : Impedance Control+BGA
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.