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Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.7mm ; Final Copper Thickness : 1OZ ; Surface Finished: ENIG ; Unit Size(mm) : 340.0*180.0 ; Panel Size(mm) : 340.0*196.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 5.9/8.66 ; Solder Mask : White ( in accordance with IPC-SM-840) ;
https://www.hoyogo.com/Products/6LPCBHYG898R06174A.htmlLayer : 6L ; Base Material : FR4 IT-180A ; Board Thickness : 1.57mm ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 190.5*127.0 ; Panel Size(mm) : 228.6*266.7 ; Min W/S(mil) : 5/5 ; Min Hole Size : 0.3mm ;
https://www.hoyogo.com/Products/HYG902R06008A.htmlLayer : 6L ; Base Material : FR4 TG135 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 161.0*168.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 7.87/7.87 ;
https://www.hoyogo.com/Products/HYG1009R06012A.htmlLayer: 6L ; Base Material: FR4 ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 58.1*80.0 ; Panel Size(mm): 259.41*190.00 ; Min W/S(mil): 7.8/5.9 ; Min Hole Size: 0.2mm ; Solder Mask: Green Matt ;
https://www.hoyogo.com/Products/HYG892R06188A.htmlLayer : 16L ; Base Material : TU-768 ; Board Thickness : 1.57±0.1mm ; Final Copper Thickness: 20um ; Surface Finished : ENIG+Golden Finger ; Special Process : Via Plug with Resin, Cap Plating ; Impedance Control ; Single Impedance : 14 group ; Differential Impedance : 13 group ; Set Size : 266.7*1...
https://www.hoyogo.com/Products/16LPCBHYG531R16001AT.htmlLayer: 6L ; Base Material: FR4 S1141 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 166.4*164.6 ; Panel Size(mm): 180.4*178.6 ; Min W/S(mil): 5/5 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG812R06042A.html;
https://www.hoyogo.com/Products/6L-FR4HDI222Flexboar.html
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