After the inner board circuit is completed, the integrity of the access and the insulation must be ensured, that is, the same inspection as the single panel is required. Because after the completion of the compaction, unfortunately, there are still defects when it is too late for the high-level board is even more important to ensure that the quality of its various layers one by one, in order to carry out the pressure, due to the high plate more, Layers heavier burden, and the line is getting smaller and thinner. Use the computer to keep in mind the original design, and then with a special wavelength light scanning, and quickly perfect the detailed examination of the layers. AOI has its limits, thin broken circuit and leakage is difficult to find, you need to increase the electrical test.