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Layer : 1L ; Base Material : FR4 TG≥135 ; Board Thickness : 1.0mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 256.0*14.1 ; Panel Size(mm) : 276.0*122.0 ;
https://www.hoyogo.com/Products/HYG293R01158A.htmlLayer: 6L ; Base Material: FR4 TG150 ; Board Thickness: 1.62mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 147.0*75.0 ; Panel Size(mm): 161.0*166.1 ; Min W/S(mil): 7/7 ; Min Hole Size: 0.3mm ; Special Request: Plug Via With Solder Mask ;
https://www.hoyogo.com/Products/HYG807R06043B.htmlLayer : 2L ; Base Material : FR4 ; Board Thickness : 1mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 102.50*71.31 ;
https://www.hoyogo.com/Products/Different-Shape-PCB.htmlLayer : 4L ; Base Material : FR4 ; Board Thickness : 1.7mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 105.0*109.5 ; Min Hole Copper Thickness : 20um ; Min Hole Size : 0.2mm ; Min W/S(mil) : 6.3/6.3 ;
https://www.hoyogo.com/Products/HYG718R04008A.htmlLayer : 8L ; Base Material : FR4 TG150 ; Board Thickness : 1.7mm ; Final Copper Thickness : 70UM ; Surface Finished : ENIG ; Unit Size(mm) : 212.0*115.0 ; Panel Size(mm) : 212.0*145.0 ; Min W/S(mil) : 7.8/7.8 ; Min Hole Size : 0.3mm ; Peelable Mask+High Temperature Adhesive ;
https://www.hoyogo.com/Products/HYG026R08023B.htmlHigh Temperature Adhesive ; Layer : 6L ; Base Material : FR4 TG150 ; Board Thickness : 1.55mm ; Surface Finished : ENIG ; Unit Size(mm) : 190.0*110.0 ; Panel Size(mm) : 190.0*134.0 ; Min W/S(mil) : 7.9/7.9 ; Min Hole Size : 0.3mm ;
https://www.hoyogo.com/Products/HYG026R06034A.htmlLayer: 6L ; Base Material: FR4 ; Board Thickness: 2.0mm ; Final Copper Thickness: 3OZ ; Surface Finished: HASL Lead Free+Peelable Mask ; Unit Size(mm): 306.88*189.38 ;
https://www.hoyogo.com/Products/HYG898R06169A.htmlLayer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 46.12*25.25 ; Panel Size(mm): 58.12*161.74 ; Min Hole Size: 0.3mm ;
https://www.hoyogo.com/Products/HYG089R02250A.htmlDouble-Sided Circuitless ; Layer : 0L ; Base Material : FR4 Yellow Core Board Material ; Board Thickness : 1.0mm ; Surface Finished : ENIG ; Unit Size(mm) : 177.02*77.0 ; Solder Mask : White ;
https://www.hoyogo.com/Products/HYG088R00048A.htmlLayer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.575mm ; Final Copper Thickness : 2/1/1/2OZ ; Surface Finished : ENIG ; Unit Size(mm) : 95.25*234.95 ; Panel Size(mm) : 95.25*234.95 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 9.8/9.8 ; Solder Mask Thickness : min 10um ;
https://www.hoyogo.com/Products/HYG902R04025A.htmlLayer : 6L ; Base Material : FR4 TG135 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 161.0*168.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 7.87/7.87 ;
https://www.hoyogo.com/Products/HYG1009R06012A.htmlLayer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 165.1*99.9 ; Panel Size(mm): 185.1*199.9 ; Min W/S(mil): 7.9/8.5 ; Min Hole Size: 0.2mm ; Solder Mask: Green Matt ;
https://www.hoyogo.com/Products/HYG892R02338A.htmlLayer: 4L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead ; Unit Size(mm): 192.0*111.4 ; Panel Size(mm): 192.0*121.4 ; Min W/S(mil): 6/9 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG807R04008A.htmlLayer : 2L ; Base Material : FR4 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 123.75*86.0 ; Panel Size(mm) : 123.75*86.0 ; Min W/S(mil) : 11.8 ; Solder Mask : White ;
https://www.hoyogo.com/Products/HYG293R02320A.htmlLayer : 4L ; Base Material : FR4 ; Board Thickness : 1.57mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 266.7*69.6 ; Min W/S(mil) : 10/10 ;
https://www.hoyogo.com/Products/HYG882R04004B.htmlLayer: 6L ; Base Material: FR4 ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 58.1*80.0 ; Panel Size(mm): 259.41*190.00 ; Min W/S(mil): 7.8/5.9 ; Min Hole Size: 0.2mm ; Solder Mask: Green Matt ;
https://www.hoyogo.com/Products/HYG892R06188A.htmlLayer: 6L ; Base Material: FR4 TG135 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 150.0*100.0 ; Min Hole Size: 0.3mm ;
https://www.hoyogo.com/Products/HYG306R06005B.htmlLayer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Min Hole Size : 0.2mm ; Solder Mask : Light Blue ;
https://www.hoyogo.com/Products/LightBlueSolderMaskP.htmlLayer : 1L ; Base Material : FR4 SY-1000-2M ; Board Thickness : 1.5mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 16.9*24.0 ; Min Hole Size : 5.0mm ; Solder Mask : / ; Tolerance : ±0.1mm ;
https://www.hoyogo.com/Products/HYG528R01113B.htmlLayer: 4L ; Base Material: FR4 CT1≥175 ; Board Thickness: 2.0mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG ; Unit Size(mm): 92.99*48.01 ; Panel Size(mm): 109.0*268.0 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG293R04003B.htmlLayer: 4L ; Base Material: FR4 TG170 ; Board Thickness: 1.575mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG ; Unit Size(mm): 17.48*15.39 ; Panel Size(mm): 127.7*157.5 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG804R04007A.htmlLayer : 2L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 58.0*61.0 ; Panel Size(mm) : 232.0*122.0 ;
https://www.hoyogo.com/Products/HYG898R02197A.htmlLayer : 4L ; Base Material : FR4 ; Board Thickness : 1.55mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 21.7*42.5 ; Panel Size(mm) : 162.0*113.0 ; Min W/S(mil) : 7.9/6.9 ; Min Hole Size : 0.15mm ;
https://www.hoyogo.com/Products/HYG293R04328A.htmlLayer: 4L ; Base Material: FR4 ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 192.0*135.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.3mm ;
https://www.hoyogo.com/Products/HYG892R04122A.htmlLayer: 6L ; Base Material: ITEQ ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 155.19*86.75 ; Panel Size(mm): 172.21*284.61 ; Min W/S(mil): 6/6 ; Min Hole Size: 0.25mm ;
https://www.hoyogo.com/Products/HYG898R06270A-ITEQ.htmlLayer : 2L ; Base Material : FR4 TG135 ; Board Thickness : 0.5mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 58.8*9.0 ; Panel Size(mm) : 80.0*128.0 ; Min W/S(mil) : 9.8/7.9 ;
https://www.hoyogo.com/Products/HYG306R02007B.htmlLayer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 0.4mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 20.83*15.0 ; Panel Size(mm): 100.0*153.0 ; Min W/S(mil): 10/6 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG293R02303A.htmlLayer: 6L ; Base Material: FR4 ; Board Thickness: 2.0mm ; Final Copper Thickness: 3OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 306.88*189.38 ;
https://www.hoyogo.com/Products/HYG898R06169B.htmlLayer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.57mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 335.28*128.83 ; Panel Size(mm) : 335.28*128.83 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 8/8.6 ;
https://www.hoyogo.com/Products/HYG905R04001A.htmlLayer: 2L ; Base Material: FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 50.0*60.0 ; Panel Size(mm): 232.0*206.0 ;
https://www.hoyogo.com/Products/HYG898R02207A.htmlLayer : 2L ; Base Material : FR4 TG150 ; Board Thickness : 1.0mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 5.5*144.0 ; Panel Size(mm) : 179.8*248.5 ; Min W/S(mil) : 19.7 ; Solder Mask : Green Matt ;
https://www.hoyogo.com/Products/HYG528R02364B.htmlLayer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Surface Finished: HASL Lead Free ; Unit Size(mm): 233.43*159.89 ; Panel Size(mm): 245.43*319.79 ; Min Hole Size: 0.3mm ; Solder Mask: Green Matt ;
https://www.hoyogo.com/Products/HYG898R02084A-HASL-Lead-Free.htmlLayer : 2L with NPTH ; Base Material : CEM3(R-1787) CTI≥600 ; Board Thickness : 1mm ; Final Copper Thickness : 1OZ ; Surface Finished : OSP ; Unit Size(mm) : 157.99*157.99 ; Panel Size(mm) : 170.43*508.0 ; Min W/S(mil) : 16/10 ; Solder Mask : White ; Special Process : Plate Bending&Twist 0.7% ; Sold...
https://www.hoyogo.com/Products/HYG528R02386A.htmlLayer: 4L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 50.0*71.5 ; Min W/S(mil): 6/6 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG021R04022B.htmlLayer: 2L ; Base Material: FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 25.4*30.36 ; Panel Size(mm): 117.6*129.43 ; Min Hole Size: 0.25mm ;
https://www.hoyogo.com/Products/HYG089R04023B.html
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