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Blind&Buried Via ; Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 25.6*16.0 ; Panel Size(mm) : 187.0*268.0 ;
https://www.hoyogo.com/Products/HYG089R06036A.htmlBlind buried vias PCB Layer: 6L Base Material: FR4 Board Thickness: 1.6mm Final Copper Thickness: 2OZ Surface Finished: ENIG Unit Size(mm): 25.6*16.0 Panel Size(mm): 187.0*268.0
https://www.hoyogo.com/Blind-buried-vias-PCB.htmlLayer: 6L Base Material: FR4 TG171 Board Thickness: 1.54mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 90.0*50.0 Panel Size(mm): 195.0*102.0 Min W/S(mil): 3.4/5.37 Min Hole Size: 0.15mm L1-L3, L3-L4, L4-L6 have blind and buried vias
https://www.hoyogo.com/blind-and-buried-vias-PCB.htmlLayer: 8L Base Material: FR4 TG150 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: ENIG+OSP+Impedance Control Unit Size(mm): 65.0*50.0 Panel Size(mm): 140.0*150.0 Min W/S(mil): 3/3 Min Hole Size: 0.1mm Solder Mask: Black 4 groups of single wire impedance and 4 groups of differen...
https://www.hoyogo.com/HDI-laser-blind-buried-via-board.htmlBlind-buried Via Board Layer: 4L Base Material: FR4 Board Thickness: 1.6mm Surface Finished: ENIG Unit Size(mm): 89.0*112.3 Panel Size(mm): 180.0*128.3 V-CUT Angle: 30 Degrees Remaining Thickness: 0.4 +/- 0.1mm
https://www.hoyogo.com/Blind-buried-Via-Board.htmlBlind Via PCB Layer: 4L Base Material: FR4 Board Thickness: 0.8mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 41.797*78.81 Panel Size(mm): 170.789*85.81 Min W/S(mil): 7/7 Min Hole Size: 0.2mm
https://www.hoyogo.com/Blind-Via-PCB.html
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